Thin Film Fabrication

ATC Orion 5 RF/DC Sputtering System (AJA International)

Sputtering System

Features:

  • Main Deposition Chamber:Ìý14.6" high x 12" OD, S/S vacuum chamber.

  • Con-Focal Sputtering:Ìýthree 2'' magnetron sputter guns with integral isolation chimneys.

  • DC and RF Generators:Ìýtwo 300 Watt RF generators and one 750 Watt DC generator.

  • Quartz Crystal Thickness Monitor.

  • Substrate Holder:Ìýaccommodates substrates up to 4" diameter; mounts to top of chamber for sputter up orientation; continous motorized rotation (0-40RPM) with controller; radiant heating to 850 C with quartz halogen lamps (+/- 1 degree C temp. stability); capable of being heated in an O2 environment;

  • Gas Handling:Ìýmass flow controlled gas line (Ar) - 20 sccm with pneumatic isolation valve(s) and filter.

  • Deposition Uniformity:Ìýtypically +/- 2.5% thickness uniformity over a 4'' diameter substrates.

  • Base Chamber Vacuum:Ìýbetter than or equal to 3.0×10-8 Torr.

Savannah 100 ALD (UltraTech / Cambridge NanoTech)

Savannah 100 ALD

Features:

  • Substrate Size:Ìýup to 200 mm

  • Substrate Temperature:Ìý25°C - 500°C; ±0.2°C

  • Precursor Sources:ÌýUp to 6, heated

  • Deposition Uniformity:Ìý&±ô³Ù;±1%

  • Deposition:ÌýHigh speed/ultra high aspect ratio

  • Control:Ìý³¢²¹²ú±¹¾±±ð·É-±«³§µþ-±Ê°ä

UHV PLD System

UHV PLD System

Ìý

Ìý

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Thermal Evaporation System

Ìý

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Ìý

Ìý

3118 E-beam evaporator (Varian)

3118 E-beam evaporator (Varian)

Ìý

Ìý

Ìý

Ìý

Ìý

Ìý

Ìý

Ìý

Ìý

Ìý

Ìý

Ìý

Ìý

Ìý

Ìý